What is a semiconductor packaging and testing injection molding head? What should be paid attention to during CNC machining?

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Semiconductor packaging and testing injection molding head technology is used in the manufacture of semiconductor equipment. The processing methods are divided into hot pressing, cold pressing, glue dropping, molding, etc. These methods require high-precision machine tools to ensure perfect embedding of components, which can effectively reduce defects caused by poor packaging. resulting faults and defects. It can be used for precise packaging of semiconductor devices, thereby improving the reliability and service life of semiconductor devices.

The advantage of the injection molding head for semiconductor packaging and testing lies in its tiny size, which can package a small amount of metal well and can be reused many times. Its use can greatly simplify the packaging process, reduce packaging costs, and improve packaging quality and reliability. In addition, the semiconductor packaging and testing injection head can also be used to improve the micro-packaging, such as nano-packaging, which can improve the packaging accuracy and meet specific application requirements.

Packaging and testing production process

The wafers manufactured by the wafer foundry will undergo an electrical test before leaving the factory, called Wafer Acceptance Test (Water Acceptance Test, WAT), and the wafers that pass the WAT test will be sent to the packaging and testing factory. The packaging and testing factory first conducts a mid-test (Chip Probe, CP) on the wafer. Due to process reasons, various manufacturing defects will be introduced, resulting in a certain amount of defective products in the bare die on the wafer. The purpose of CP testing is to find out these defective products before packaging and reduce the cost of subsequent packaging and testing. After the wafer manufacturing is completed, the chip function is tested by contacting the probe with the pad on the chip, and the unqualified chips are marked and screened after dicing.

After the CP test is completed, it enters the packaging process. The packaging process can generally be divided into two parts. The process steps before plastic packaging are called front-end operations, and the process steps after molding are called back-end operations. The basic process includes wafer thinning, wafer dicing, chip placement, curing, chip interconnection, injection molding, deburring, soldering, rib trimming, coding, etc. Due to different packaging technologies, the process flow will be different, and testing will also be carried out during the packaging process. After the packaging is completed, the final test (Final Test, FT) is required, and the products that pass the FT test can be shipped to the outside world.

Image source: Yushi Capital

What are the semiconductor packaging consumables?

Semiconductor packaging consumables are special materials used to package electronic components. They are usually composed of metal, plastic, rubber and other materials to provide protection and support to the packaged components to ensure their performance and reliability in operation. Semiconductor packaging consumables will provide physical and electrical protection of electronic components, and will be connected to other components, using circuit structures to connect them. Consumables can also enhance the thermal expansion, pressure resistance and wear resistance of these electronic components to improve their reliability in use and application.

Consumables for semiconductor packaging include:

1. Barrel

2. Injection molding head

3. Mold box

4. Thimble

5. Tendon cutting knife

6. Rib cutting die

7. Welding head,

8. Ceramic chopping knife

9. Die head

10. Tungsten steel pressure jaw

11. Gate blocks, etc.

What should be paid attention to in the manufacture of semiconductor injection molding heads?

Selection of materials: It is necessary to use materials with high temperature resistance, corrosion resistance, low sealing stress and good electromagnetic shielding performance to ensure the reliability and reliability of the product.

Product design: The design of the semiconductor injection molding head must consider the packaging process, packaging process, and the characteristics of the plastic liquid to ensure the reliability of the packaging.

Process control: The packaging process of the semiconductor injection  molding head must be strictly controlled, and the key parameters include packaging temperature, pressure and time, etc., to ensure the reliability and reliability of the product.

Product inspection: Effective inspection must be carried out after the semiconductor injection molding head is packaged, and the inspection shall be organized according to the customer's requirements to ensure product quality.

What are the reasons that affect the life of semiconductor packaging and testing injection molding head?

Electrical environment: Semiconductor packaging and testing injection molding heads may be damaged by electrical environments such as static electricity, electromagnetic interference, and thermal shock, resulting in a shortened lifespan.

Processing conditions: The packaging process of the packaging and testing injection  molding head and the temperature, humidity, pressure and other parameters of the material will affect the performance of the packaging and testing injection head. Improper processing conditions will shorten the life of the sealing and testing injection head.

User use: The use environment and correct use method of the semiconductor packaging and testing injection molding head will also affect its service life, and incorrect use will shorten its service life.

What are the benefits of using CNC to process semiconductor packaging and testing injection molding heads?

High precision: CNC machining semiconductor packaging and testing injection molding head can produce parts with precision up to 0.01mm. This precision far exceeds that of traditional machining processes and ensures the production of more precise parts.

Fast: CNC machining semiconductor packaging and testing injection molding head is faster than traditional machining, and can complete production tasks faster.

Stability: CNC machining semiconductor packaging and testing injection molding head can provide stable and reliable mass production, and can meet a large number of needs.

Low cost: Due to the high efficiency of CNC machining semiconductor packaging and testing injection molding head, the utilization rate of materials can be improved, thereby reducing production costs.

Image source: micro-mechanics

Goodwill Precision Machinery has been deeply involved in the supporting field of high-end precision machining industry for 18 years. It started with precision machining, but it is not limited to the field of precision machining. It has diversified and cross-regional group development of various industrial supporting production bases in Dongguan with 100,000 m² and Suzhou with 30,000 m². m², supply high-end precision parts processing and component assembly, image measurement equipment and services, standard lithium battery testing equipment, non-standard automation, high-end equipment non-marking sheet metal manufacturing, and in Japan technology research and development and sales center, German sales center, international layout The multilingual industrial service network is committed to building a high-tech industrial supporting service enterprise for R&D, production and sales, covering middle and high-end markets such as China, Europe, the United States, and Australia, as well as leading customers in the industry. Provide high-quality services to customers in the fields of driving, semiconductors, robots, optics, new energy, nuclear power, ships, ocean engineering, and aerospace. If your company has corresponding parts that need to be processed, please contact us!