Shengying Semiconductor achieves a breakthrough in the localization of semiconductor electrochemical deposition (ECD) equipment

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Recently, Shengying Semiconductor, located in Xiangcheng Economic Development Zone, delivered the first localized semiconductor electrochemical deposition (ECD) equipment, achieving an important breakthrough in the localized R&D and manufacturing of core equipment in the electronic information industry in Suzhou.

 

ECD Stratus P300 is a semiconductor electrochemical deposition equipment independently developed by SWAT, which can realize wafer processing tasks of 200-300mm, and can be configured with up to six different plating materials.

Widely used in: under-bump metal layer/rewiring process, fan-out packaging, RF filter wafer-level packaging, power device packaging and other advanced packaging wafer preparation process.

Stratus P300 has an internationally patented vertical electroplating technology. The key process is that, through the wafer clamp and the patented sealing technology CRS, the wafer is carried under a closed current field effect to complete the preparation of metal deposition on the surface of the wafer. Compared with other similar equipment, the Stratus P300 processes wafers with more electroplating tanks and better process results. It also shows superior strength in electroplating uniformity and automatic detection.

Before the delivery of P300, Shengying Semiconductor had a variety of products with different processes, such as: Apollo EMI mobile device packaging equipment, Apollo UBM/RDL/BSM100-200mm wafer processing equipment, Apollo UBM/RDL 150-300 wafer processing equipment Equipment, Stratus Wafer S200 (100-200mm) S300 (200-300mm) electrochemical wafer processing equipment and other equipment delivery.

SWAT is abbreviated as SWAT, which is the abbreviation of Semiconductor Wet Advanced Technology. The company is a joint venture subsidiary established by world semiconductor giant ASMPT and Zhilu Capital in China. It was registered and established in Fuyang Intelligent Manufacturing Industrial Park, Xiangcheng Economic Development Zone in June 2021. As a system engineering integration company that realizes the fabrication of semiconductor integrated circuits (microchips), Shengying Semiconductor Equipment (Jiangsu) Co., Ltd. introduces industrial technology, engineering design and software control into the metal deposition process of microchip interconnection in semiconductor wafers, specially designed for Customized metallization deposition equipment and solutions in the field of advanced packaging are widely recognized by the industry.

Source of information: cepem

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