Basic Concepts and Equipment Classification
Definition of semiconductor equipment: Semiconductor equipment refers to the production equipment required for the manufacture of various semiconductor products, as well as other types of machinery and equipment required for the production of semiconductor raw materials, which belong to the supporting link of the semiconductor industry chain. Among them, the core special equipment for the production of semiconductors is the technological leader of the semiconductor industry. Chip design, wafer manufacturing and packaging and testing must be designed and manufactured within the scope of equipment technology. The technological progress of equipment in turn promotes the development of the entire industry.
Semiconductor equipment classification: Semiconductor equipment can be divided into two categories: front-end equipment (wafer manufacturing) and back-end equipment (packaging and testing). The front-end equipment involves silicon wafer processing, lithography, etching, ion implantation, film deposition, cleaning, polishing, metallization and other processes. The corresponding core special equipment includes silicon wafer processing equipment, lithography equipment, etching equipment, cleaning equipment, etc. equipment, ion implantation equipment, thin film deposition equipment, mechanical polishing equipment, measurement equipment, etc. Back-end equipment includes packaging equipment and testing equipment.
Front-end equipment accounts for the main part. Equipment investment generally accounts for 70~80%. When the process reaches 16/14nm, equipment investment accounts for 85%; 7nm and below will account for a higher proportion. Classified by process flow, typical production line front-end, packaging, and testing equipment account for 85%, 6%, and 9%, respectively.
High demand for testing. The compound growth rate of semiconductor equipment from 2013 to 2018 was 15%, and the growth rates of front-end, packaging, and testing equipment were 15%, 11%, and 16%, respectively. The fastest growing sub-projects are etching equipment (CAGR 24%) and storage test equipment (CAGR 27%). According to SEMI, the global semiconductor testing equipment market size will reach US$7.79 billion in 2021, a year-on-year increase of 29.6%, and it is expected that the market size will further grow to US$8.17 billion in 2022.
The top five equipment companies in the world dominate the market. In the global equipment competition pattern, the main front-end processes (etching, deposition, gluing, heat treatment, cleaning, etc.) are integrated into the top three AMAT, LAM, and TEL. In addition, the lithography machine leader ASML has a market share of 80%+; the process control leader KLA has a market share of 50%. According to SEMI, the five major manufacturers of ASML, AMAT, LAM Research, TEL and KLA will have a combined revenue of US$78.8 billion in 2021, accounting for about 77% of the global market.
As the nanoscale process of chips is approaching the limit of Moore's Law, the precision of semiconductor equipment is getting higher and higher, and the localization of domestic semiconductor equipment and key components of semiconductor equipment has a long way to go. We need more capital investment and technological breakthroughs to bring The change in the localization of equipment coming!
Source: Zhihu Xingxingcha, Guosheng Securities Research Institute
Godwill Precision Machinery has 18 years of experience in precision machining, and has rich experience in high-precision parts processing in the fields of automation, driverless, semiconductor, new energy, medical, communications, automotive, optics, lighting, etc. If you also have related If the parts need to be processed, please contact us!
