Semiconductor packaging and testing heat welding drill bit is a special processing tool for welding thermoplastic materials on electronic components. It is a small, multi-purpose drill that can perform deep soldering, test soldering, and teardown soldering on electronic components. The thermal welding drill bit for semiconductor packaging and testing has the advantages of high precision, high speed, low energy consumption and low noise, etc. It can achieve high efficiency, low damage and short cycle processing, and obtain good welding and testing results. It has good reliability, can be used in a variety of environments, and has a high degree of troubleshooting capability.
Difficulties in precision machining of thermal welding drills for semiconductor packaging and testing?
The precision machining of thermal welding drills for semiconductor packaging and testing is a complex task that requires in-depth knowledge of various aspects. Considering the choice of semiconductor package, the control of thermal soldering parameters, and the mechanical characteristics of the drill are all important issues to consider.
At the same time, affected by the heat source, the packaging process will generate a lot of heat, which requires that the thermal conductivity of the drill must be sufficient. In addition, various methods such as laser and water jet also need to be considered during machining to ensure that the accuracy will not be affected.
Finally, in terms of material selection, tungsten steel, high carbide and nanotechnology can also be used to improve accuracy, but the price is relatively higher.
What materials are generally used for semiconductor packaging and testing thermal welding drills?
Semiconductor packaging and testing thermal welding drills are generally made of materials that are resistant to high temperatures and are not easily deformed by heat, such as stainless steel, hard alloys and special alloys. In addition, drill bits also need to have good fatigue resistance and wear resistance in order to meet complex processing requirements. Therefore, when choosing a material, a specially treated cemented carbide or a high-hardness wear-resistant material containing elements such as titanium or chromium is generally selected.
How to CNC process the thermal welding drill for semiconductor packaging and testing?
The numerical control machining of thermal welding drills for semiconductor packaging and testing requires special equipment and processes. First of all, it is necessary to use CAD software to design the drawings of the thermal welding drill for semiconductor packaging and testing, then convert the instructions in the drawings into instructions that can be recognized by the CAM software, and finally use the corresponding CNC controller to complete the processing. During the CNC machining process, the CNC controller can be used to monitor the machining process in real time to ensure that the drill bit and welding quality meet the requirements. In addition, during processing, vacuum or gas packaging can be used to prevent overheating and ensure the quality of the drill bit.
What are the difficulties in CNC machining of thermal welding drills for semiconductor packaging and testing?
Heat sensitivity of materials: The materials of semiconductor packaging chips are often brittle and easily affected by temperature, so the temperature needs to be controlled during thermal welding to avoid damage to the chip.
Accuracy: The chip size of the semiconductor package is very small, and the position between each chip is mostly at the decimeter level, so the CNC machining needs to be particularly precise, and at the same time, it must be controlled according to the size and position of the chip. Due to the complexity of the semiconductor package, the accuracy of the drill bit position is higher, especially in the case of deep holes and more packaging layers, the drill bit needs to strictly control the hole diameter, depth and angle to ensure the thermal welding effect.
Decontamination: During the processing, a lot of dust may remain, and the chip size is small, so it is very difficult to remove the dust, which requires the processing equipment to be equipped with sufficient dust suction devices and precise cleaning technology.
Thermal welding process control: Thermal welding process control is a key step in the CNC machining of thermal welding drills. Generally, it is necessary to consider the adjustment of machine parameters, temperature, processing speed and other parameters, as well as the selection of materials and the setting of welding parameters to ensure welding quality.
What are the reasons that affect the service life of semiconductor packaging and testing thermal welding drills?
There are many factors that affect the service life of heat welded drill bits, but the most important thing is the correct selection and use, as well as quality inspection.
Material characteristics: Drills made of different materials have different thermal welding properties. Heat resistance, corrosion resistance, hardness, etc. will affect the life of thermally welded drills.
Voltage control: choosing the correct voltage and controlling the voltage fluctuation can increase the service life of the heat welding drill.
Heating time and temperature: The heating time and temperature of heat welding should not be too short or too high, which will affect the quality of the heat welding drill bit, thereby affecting its life.
Thermal welding parameters: Control the thermal welding parameters, such as welding current, welding time, temperature and speed, etc., to ensure the welding quality, the strength of the connection after welding and the safety and reliability of the welding process.
How to use CNC precision machining technology to improve the life of semiconductor packaging and testing thermal welding drills?
First of all, precision machining can reduce material waste, thereby improving the reliability of thermal welding drills; secondly, precision machining can improve processing quality and reduce material loss; thirdly, precision machining can effectively improve the accuracy of thermal welding drills, thereby reducing Errors in the heat welding process; finally, precision machining can increase processing speed and reduce processing time, thereby reducing the wear and tear of heat welding drills. Finally, the cutting edge of the welding drill bit is finished by using CNC precision machining technology, so that the cutting edge has good compactness and precision, so as to ensure the accuracy of the welding layer of the socket and improve the service life of the welding drill bit. It is also possible to use more advanced knives such as knives, knives or vortexers to reduce the heat load and increase the service life. And it is possible to adjust the process, such as changing the feed speed, cutting depth and feeding distance, to better control the thermal stress and thermal load on the material surface, so as to avoid excessive feed speed and one-time deep cutting depth for welding drills An important process that results in a shortened service life. All in all, CNC precision machining will effectively improve the service life of semiconductor thermal welding drill bits. Zhaoheng Machinery has nearly 20 years of experience in precision parts processing. We have derived a unique processing operation method in terms of technology, material cognition, product quality control, material technology and cost control. Based on more than 20 years of experience The professional technical team and the global high-end imported processing and testing equipment group provide strong quality assurance for each customer's parts!
